WAFER


 

Specifikacija Wafer-ja

 

 

Premer (mm)

 25,4

 50,8

 76,2

 100,0

125,0

150,0

 

 

 

 

Tip in elementi dopiranja

 n-type

  • P   - Phosphorus
  • Sb - Antimony
  • As - Arsenic doped

 p-type

  • B - Boron

 

 

 

 

Orientiranost

(100)

(110)

(111)

 

 

Toleranca orientiranosti

standard : +/- 0,5°
upon request : until +/- 0,01°

 

 

Odmik od orientiranosti

upon request (up to 25°)

 

 

 

 

Upornost

Cz : From 1 milliohmcm to 150 Ωcm
FZ : up to 10 kΩcm

 

 

Debelina

 

1"

2"

3"

4"

5"

6"

standard (µm )

250

275

380

525

625

675

tolerance +/- (µm )

15

25

25

20

20

20

 

 

 

 

Površina

As Cut

Lapped

Etched

SSP

DSP

 

 

Premer *

1"

2"

3"

4"

5"

6"

 

 

Particle count

10-25

10-25

10-25

< 10

< 15

< 15

 

 

TTV Std (µm) *

7

12

10

10

10

10

 

 

TTV min (µm) *

3

3

3

2

3

3

 

 

Bow (µm)   *

< 30

< 30

< 30

< 40

< 40

< 40

 

 

 

Roughness (Ra)

On polished surface : Less than 1 nm

 

 

Flatness

On polished surface : Less than 1 µm

 

 

Laser marking

Upon request

 

SEMI STANDARDS

All other specifications comply with SEMI STD (packaging, product identification, ...)